Etching processes are critical to MEMS and microfabrication. Vmicro has developed a large experience in that domain and proposes standard and key processes using wet and dry etching techniques.

Silicon etching know-how

• Vertical plasma etching of silicon layers from 50 nm to 500 µm
• Anisotropic silicon etch (TMAH, KOH)
• XeF₂ isotropic etching

Deep Reactive Ion Etching

• DRIE recipe development beyond standard processes
• Through wafer etching from top side or back side
  

Other Etching Processes

• SiO₂ / SiN etching : ICP-RIE plasma, vapor HF, wet etching & supercritical drying

• Other materials : III-V, III-N, metals, cleanroom compatible polymers