Etching processes are critical to MEMS and microfabrication. Vmicro has developed a large experience in that domain and proposes standard and key processes using wet and dry etching techniques.

Silicon etching know-how

  • Vertical plasma etching of silicon layers from 50 nm to 500 µm
  • Anisotropic silicon etch (TMAH, KOH)
  • XeF2 isotropic etching

Deep Reactive Ion Etching

We have an extensive experience on :

  • Wall roughness smoothing control
  • Through wafer etching from top side or back side

Other Etching Processes

  • SiO2 / SiN etching : ICP-RIE plasma, vapor HF, wet etching & supercritical drying
  • Other materials : III-V, III-N, metals, cleanroom compatible polymers

  • High aspect ratio MEMS etching

  • Silicon dioxide etching in vapor phase HF

  • 220 nm SOI top layer etching with vertical smooth side wall

  • Si micropillar arrays

  • Sharp silicon nanotip

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