Etching processes are critical to MEMS and microfabrication. Vmicro has developed a large experience in that domain and proposes standard and key processes using wet and dry etching techniques.
Silicon etching know-how
- Vertical plasma etching of silicon layers from 50 nm to 500 µm
- Anisotropic silicon etch (TMAH, KOH)
- XeF2 isotropic etching
Deep Reactive Ion Etching
We have an extensive experience on :
- Wall roughness smoothing control
- Through wafer etching from top side or back side
Other Etching Processes
- SiO2 / SiN etching : ICP-RIE plasma, vapor HF, wet etching & supercritical drying
- Other materials : III-V, III-N, metals, cleanroom compatible polymers
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High aspect ratio MEMS etching
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Silicon dioxide etching in vapor phase HF
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220 nm SOI top layer etching with vertical smooth side wall
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Si micropillar arrays
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Sharp silicon nanotip
