Multi-scale capabilities
Vmicro’s completed and ongoing projects have involved multi-scale process engineering ranging from 100 nm to 100 µm. Today we are thus able to offer a large variety of advanced lithography processes both in optical and e-beam lithography.
- Optical lithography from 100 µm to 1 µm
- E-beam lithography from 1 µm to 50 nm
- Fast prototyping <1µm with e-beam lithography on large areas
- Wide range of resists: DUV, PMMA, Az nLOF, HSQ
- Combine high resolution to thick resists for deep etching of high aspect ratio structures
- Combine high resolution to high density patterning with advanced proximity correction
-
50 nm linewidth features
-
Micropillar arrays made of 700 nm thick resist
-
7 μm thick resist patterned by ebeam lithography
