Multi-scale capabilities

Vmicro’s completed and ongoing projects have involved multi-scale process engineering ranging from 100 nm to 100 µm. Today we are thus able to offer a large variety of advanced lithography processes both in optical and e-beam lithography.

  • Optical lithography from 100 µm to 1 µm
  • E-beam lithography from 1 µm to 50 nm
  • Fast prototyping <1µm with e-beam lithography on large areas
  • Wide range of resists: DUV, PMMA, Az nLOF, HSQ
  • Combine high resolution to thick resists for deep etching of high aspect ratio structures
  • Combine high resolution to high density patterning with advanced proximity correction
  • 50 nm linewidth features

  • Micropillar arrays made of 700 nm thick resist

  • 7 μm thick resist patterned by ebeam lithography

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