Device processing
Design & Technical studies
Vmicro works at all Technological Readiness Levels (TRLs): from ideas at TRL1 to preproduction runs at TRL7–9.
- Test your device concept with short design or technological loops to help decision-making.
- Establish design rules for increasing the TRL of your project.
- Start the first reliability studies.
Vmicro explores design variations for :
- Preparing larger scale transfers to foundries
- Device performance assessments
Process integration
- Vmicro provides complex process sequences tailored to go from substrate to final device.
- We provide design service to our customers at each step of their projects, from concept to design rules definition and mask layout.
- Vmicro’s main know-how is based on years of experience in micro and nanotechnology and covers silicon processing for MEMS, photonic and electron devices.
For more information on our expertise, please click on the menus below:
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Microdevices fabricated by Vmicro
Year
2023
Device
Silicon resonator
Customer
Univ. Birmingham, IMST GmbH, ESA (European Space Agency)
Key technological aspects done by Vmicro
Specific Deep Reactive Ion Etching (DRIE) process for
1 mm thick silicon etching with low scallop and large device.
Specific process blocks for maintaining ultra- high resistivity
Year
2023
Device
MEMS sensors for transient pressures measurements
Customer
Phonoptics
Key technological aspects done by Vmicro
MEMS sensor from substrate to device.
Reference
Year
2022
Device
Nano optical gratings, optical combiner
Customer
Interdigital R&D (ex Technicolor)
Key technological aspects done by Vmicro
Participation to process flow chart definition
PECVD Silicon Nitride Index tuning
Nanolithography: e-beam
Plasma etching and full process integration
Year
2021
Device
Micro-nano bolometer compatible with THz radiation
Customer
S. Barbieri – IEMN UMR CRNS 8520
Key technological aspects done by Vmicro
Process proposition
Design rules definition
Fabrication of nanostructured bolometer on SOI substrate
Reference
Year
2021
Device
Photonic cavity, SOI platform for THz sensors
Project
TERAFOOD INTERREG consortium
Key technological aspects done by Vmicro
Full fabrication of the devices.
Back-end technical solutions.
Specific DRIE silicon etching processes
Year
2019
Device
Optomechanical Atomic Force Microscope probe proof of concept
Project
ANR Olympia
Key technological aspects done by Vmicro
Fabrication of the first prototypes with new design rules. Co-fabrication with consortium partners.
Reference
