Device processing

Design & Technical studies


Vmicro works at all Technological Readiness Levels (TRLs): from ideas at TRL1 to preproduction runs at TRL7–9.
  • Test your device concept with short design or technological loops to help decision-making.
  • Establish design rules for increasing the TRL of your project.
  • Start the first reliability studies.
Vmicro explores design variations for :
  • Preparing larger scale transfers to foundries
  • Device performance assessments

Process integration

  • Vmicro provides complex process sequences tailored to go from substrate to final device.
  • We provide design service to our customers at each step of their projects, from concept to design rules definition and mask layout.
  • Vmicro’s main know-how is based on years of experience in micro and nanotechnology and covers silicon processing for MEMS, photonic and electron devices.

    Microdevices fabricated by Vmicro

    si-resonator2
    Silicon ultra-low losses RF 40GHz resonator
    Year
    2023
    Device
    Silicon resonator
    Customer
     Univ. Birmingham, IMST GmbH, ESA (European Space Agency)
    Key technological aspects done by Vmicro
    Specific Deep Reactive Ion Etching (DRIE) process for
    1 mm thick silicon etching with low scallop and large device.
    Specific process blocks for maintaining ultra- high resistivity
    phonoptics-min
    (a) Microphone for fiber optical read-out (b) SEM picture of the MEMS membrane
    Year
    2023
    Device
    MEMS sensors for transient pressures measurements
    Customer
    Phonoptics
    Key technological aspects done by Vmicro
    MEMS sensor from substrate to device.
    interdigital
    Nano optical gratings: (a) SEM picture of the grating, (b) cross section by FIB (Focused Ion Beam), (c) schematic of one U-shaped unit
    Year
    2022
    Device
    Nano optical gratings, optical combiner
    Customer
    Interdigital R&D (ex Technicolor)
    Key technological aspects done by Vmicro
    Participation to process flow chart definition
    PECVD Silicon Nitride Index tuning
    Nanolithography: e-beam
    Plasma etching and full process integration
    Antena
    Micro-nanobolometer based on MEMS double cantilever
    Year
    2021
    Device
    Micro-nano bolometer compatible with THz radiation
    Customer
    S. Barbieri – IEMN UMR CRNS 8520
    Key technological aspects done by Vmicro
    Process proposition
    Design rules definition
    Fabrication of nanostructured bolometer on SOI substrate
    Photonic cavity on a SOI based silicon wageguide for THz spectroscopy
    Year
    2021
    Device
    Photonic cavity, SOI platform for THz sensors
    Project
    TERAFOOD INTERREG consortium
    Key technological aspects done by Vmicro
    Full fabrication of the devices.
    Back-end technical solutions.
    Specific DRIE silicon etching processes
    Suspended Photonic guides and resonators on silicon dioxide pedestal
    Year
    2019
    Device
    Optomechanical Atomic Force Microscope probe proof of concept
    Project
    ANR Olympia
    Key technological aspects done by Vmicro
    Fabrication of the first prototypes with new design rules. Co-fabrication with consortium partners.
    Atomic Force Microscope probe with integrated transducers and shuttle design
    Year
    2017
    Device
    AFM probe based on MEMS sensor
    Project
    Vmicro internal R&D + IEMN collaboration
    Key technological aspects done by Vmicro
    Transducers design, piezoresistive and electrothermal
    Probe design
    Full fabrication
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